Keyword: electronics
Paper Title Other Keywords Page
MO4AO02 HydRA: A System-on-Chip to Run Software in Radiation-Exposed Areas radiation, software, electron, FPGA 217
 
  • T. Gingold, G. Daniluk, J. Serrano, T. Włostowski
    CERN, Meyrin, Switzerland
  • M. Rizzi
    PSI, Villigen PSI, Switzerland
 
  In the context of the High-Luminosity LHC project at CERN, a platform has been developed to support groups needing to host electronics in radiation-exposed areas. This platform, called DI/OT, is based on a modular kit consisting of a System Board, Peripheral Boards and a radiation-tolerant power converter, all housed in a standard 3U crate. Groups customise their systems by designing Peripheral Boards and developing custom gateware and software for the System Board, featuring an IGLOO2 flash-based FPGA. It is compulsory for gateware designs to be radiation-tested in dedicated facilities before deployment. This process can be cumbersome and affects iteration time because access to radiation testing facilities is a scarce commodity. To make customisation more agile, we have developed a radiation-tolerant System-on-Chip (SoC), so that a single gateware design, extensively validated, can serve as a basis for different applications by just changing the software running in the processing unit of the SoC. HydRA (Hydra-like Resilient Architecture) features a triplicated RISC-V processor for safely running software in a radiation environment. This paper describes the overall context for the project, and then moves on to provide detailed explanations of all the design decisions for making HydRA radiation-tolerant, including the protection of programme and data memories. Test harnesses are also described, along with a summary of the test results so far. It concludes with ideas for further development and plans for deployment in the LHC.
https://ohwr.org/project/hydra/wikis/home
https://ohwr.org/project/diot/wikis/home
 
slides icon Slides MO4AO02 [11.131 MB]  
DOI • reference for this paper ※ doi:10.18429/JACoW-ICALEPCS2023-MO4AO02  
About • Received ※ 06 October 2023 — Accepted ※ 13 October 2023 — Issued ※ 27 October 2023  
Cite • reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)  
 
THPDP060 Beam Instrumentation Simulation in Python simulation, electron, instrumentation, framework 1454
 
  • M. Gonzalez-Berges, D. Alves, A. Boccardi, V. Chariton, I. Degl’Innocenti, S. Jackson, J. Martínez Samblas
    CERN, Meyrin, Switzerland
 
  The design of acquisition electronics for particle accelerator systems relies on simulations in various domains. System level simulation frameworks can integrate the results of specific tools with analytical models and stochastic analysis. This allows the designer to estimate the performance of different architectures, compare the results, and ultimately optimize the design. These simulation frameworks are often made of custom scripts for specific designs, which are hard to share or reuse. Adopting a standard interface for modular components can address these issues. Also, providing a graphical interface where these components can be easily configured, connected and the results visualised, eases the creation of simulations. This paper identifies which characteristics ISPy (Instrumentation Simulation in Python) should fulfill as a simulation framework. It subsequently proposes a standard format for signal-processing simulation modules. Existing environments which allow script integration and an intuitive graphical interface have then been evaluated and the KNIME Analytics Platform was the proposed solution. Additionally, the need to handle parameter sweeps for any parameter of the simulation, and the need for a bespoke visualisation tool will be discussed. Python has been chosen for all of these developments due to its flexibility and its wide adoption in the scientific community. The ensuing performance of the tool will also be discussed.  
poster icon Poster THPDP060 [2.931 MB]  
DOI • reference for this paper ※ doi:10.18429/JACoW-ICALEPCS2023-THPDP060  
About • Received ※ 07 October 2023 — Accepted ※ 08 December 2023 — Issued ※ 12 December 2023  
Cite • reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)