ICALEPCS2023 - List of Authors (Daniluk, G.)

Paper	Title	Page
MO4AO02	HydRA: A System-on-Chip to Run Software in Radiation-Exposed Areas	217
	T. Gingold, G. Daniluk, J. Serrano, T. Włostowski CERN, Meyrin, Switzerland M. Rizzi PSI, Villigen PSI, Switzerland
	In the context of the High-Luminosity LHC project at CERN, a platform has been developed to support groups needing to host electronics in radiation-exposed areas. This platform, called DI/OT, is based on a modular kit consisting of a System Board, Peripheral Boards and a radiation-tolerant power converter, all housed in a standard 3U crate. Groups customise their systems by designing Peripheral Boards and developing custom gateware and software for the System Board, featuring an IGLOO2 flash-based FPGA. It is compulsory for gateware designs to be radiation-tested in dedicated facilities before deployment. This process can be cumbersome and affects iteration time because access to radiation testing facilities is a scarce commodity. To make customisation more agile, we have developed a radiation-tolerant System-on-Chip (SoC), so that a single gateware design, extensively validated, can serve as a basis for different applications by just changing the software running in the processing unit of the SoC. HydRA (Hydra-like Resilient Architecture) features a triplicated RISC-V processor for safely running software in a radiation environment. This paper describes the overall context for the project, and then moves on to provide detailed explanations of all the design decisions for making HydRA radiation-tolerant, including the protection of programme and data memories. Test harnesses are also described, along with a summary of the test results so far. It concludes with ideas for further development and plans for deployment in the LHC. https://ohwr.org/project/hydra/wikis/home https://ohwr.org/project/diot/wikis/home
	Slides MO4AO02 [11.131 MB]
DOI •	reference for this paper ※ doi:10.18429/JACoW-ICALEPCS2023-MO4AO02
About •	Received ※ 06 October 2023 — Accepted ※ 13 October 2023 — Issued ※ 27 October 2023
Cite •	reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)

Paper

Title

Page

HydRA: A System-on-Chip to Run Software in Radiation-Exposed Areas

217

T. Gingold, G. Daniluk, J. Serrano, T. Włostowski
CERN, Meyrin, Switzerland
M. Rizzi
PSI, Villigen PSI, Switzerland

In the context of the High-Luminosity LHC project at CERN, a platform has been developed to support groups needing to host electronics in radiation-exposed areas. This platform, called DI/OT, is based on a modular kit consisting of a System Board, Peripheral Boards and a radiation-tolerant power converter, all housed in a standard 3U crate. Groups customise their systems by designing Peripheral Boards and developing custom gateware and software for the System Board, featuring an IGLOO2 flash-based FPGA. It is compulsory for gateware designs to be radiation-tested in dedicated facilities before deployment. This process can be cumbersome and affects iteration time because access to radiation testing facilities is a scarce commodity. To make customisation more agile, we have developed a radiation-tolerant System-on-Chip (SoC), so that a single gateware design, extensively validated, can serve as a basis for different applications by just changing the software running in the processing unit of the SoC. HydRA (Hydra-like Resilient Architecture) features a triplicated RISC-V processor for safely running software in a radiation environment. This paper describes the overall context for the project, and then moves on to provide detailed explanations of all the design decisions for making HydRA radiation-tolerant, including the protection of programme and data memories. Test harnesses are also described, along with a summary of the test results so far. It concludes with ideas for further development and plans for deployment in the LHC.
https://ohwr.org/project/hydra/wikis/home
https://ohwr.org/project/diot/wikis/home

Slides MO4AO02 [11.131 MB]

DOI •

reference for this paper ※ doi:10.18429/JACoW-ICALEPCS2023-MO4AO02

About •

Received ※ 06 October 2023 — Accepted ※ 13 October 2023 — Issued ※ 27 October 2023

Cite •

reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)